This dummy module occupies unused slots within a Modicon Quantum chassis. It effectively maintains proper cooling airflow across adjacent active modules. The unit also prevents dust accumulation inside empty backplane connectors. Users gain a simple solution for preserving system integrity and thermal balance.
Mechanical Construction and Physical Dimensions
This filler module features a lightweight but durable plastic housing for long service life. It measures 128 mm in width and 35 mm in height. The depth reaches 140 mm to align with standard Quantum form factors. The total weight comes to approximately 0.15 kg for easy handling during installation. Its compact design does not strain the backplane or mounting rails.
| Parameter | Specification |
|---|---|
| Model | 140XCP51000 |
| Product Type | Dummy / Filler Module |
| Width | 128 mm |
| Height | 35 mm |
| Depth | 140 mm |
| Weight | 0.15 kg |
| Chassis Compatibility | Modicon Quantum |
| Material | High-impact thermoplastic |
| Color | Light gray (matches standard modules) |
| Mounting Orientation | Horizontal (rack-based) |
Thermal Management and Airflow Optimization
This module creates a physical barrier that directs cooling air horizontally through the rack. Proper airflow prevents localized hot spots near sensitive electronics. The solid front face promotes even air distribution across all occupied slots. This design philosophy reduces the risk of thermal stress on neighboring I/O modules. Consequently, the entire system maintains a more stable operating temperature profile.
Slot Protection and Environmental Sealing
The 140XCP51000 covers exposed backplane connectors when modules remain absent. It guards against accidental contact with metal tools or debris during maintenance. The housing material resists common industrial contaminants like oil mist and non-corrosive dust. This protection prolongs the connector pin life and preserves signal integrity. It also reduces the frequency of cleaning routines for the control cabinet.
Installation Simplicity and Mechanical Retention
Installing this filler module requires no wiring or configuration steps whatsoever. Users simply slide the unit into the desired rack slot until it clicks securely. An integrated locking mechanism holds the module firmly in place. Removal involves pressing the top and bottom release latches simultaneously. This straightforward process minimizes downtime during system reconfiguration.
Details
| Weight | 0.15 kg |
|---|---|
| Dimensions | 128 × 35 × 140 mm |
Reviews
There are no reviews yet.