Remote DIO Drop Interface for Quantum Automation Systems
The Schneider 140CRA21110C serves as a remote DIO drop interface within the Modicon Quantum automation platform. This module connects distributed I/O drops to the main Quantum backplane for seamless data exchange. Its design simplifies wiring and reduces cabinet space in large-scale control systems.
This interface module supports up to 64 digital input and output points per drop. A built-in power supply provides isolated power to connected field devices and modules. The unit communicates with the Quantum processor via the remote I/O network.
Technical Specifications
| Parameter | Specification |
|---|---|
| Model | 140CRA21110C |
| Type | DIO Drop Interface Module |
| Platform | Modicon Quantum |
| I/O Points Supported | Up to 64 digital points |
| Communication | Remote I/O network |
| Power Supply | 5 VDC (internal), 24 VDC (isolated) |
| Isolation | 1500 VDC (field to logic) |
| Mounting | Quantum backplane |
| Dimensions | 249.4 x 70 x 112 mm |
| Weight | 0.35 kg (approx.) |
| Operating Temp | 0 °C to 60 °C |
| Compliance | UL, CSA, CE |
The 140CRA21110C supports up to 64 digital points for flexible system configuration. Its isolated power supply protects the control logic from electrical noise. The remote I/O network communication ensures reliable data transfer between drops and the processor.
This drop interface mounts directly on the Quantum backplane for straightforward integration. Its compact dimensions optimize cabinet space and simplify maintenance access. The module also features diagnostic LEDs for convenient status monitoring.
The 140CRA21110C integrates with Quantum processors and remote I/O drops seamlessly. Its robust design supports reliable operation across a wide temperature range. Therefore, this module provides a dependable solution for distributed control applications.
Details
| Weight | 0.35 kg |
|---|---|
| Dimensions | 249.4 × 70 × 112 mm |
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