I/O modules

Key Technical Specifications

This GE IS200EPMCH1A IS200EPMCH1ADB board operates from a 3.3V DC PCI bus supply. It implements a 32-bit PCI mezzanine card (PMC) form factor. The unit measures 14 cm in length, 10 cm in width, and 1.8 cm in height. Its total weight equals 0.2 kg without any packaging materials.

The GE IS200EPMCH1A IS200EPMCH1ADB includes one PCI bridge chip for host communication. Additionally, it features two 64-pin PMC connectors for stacking multiple cards. A single front panel I/O connector provides external signal access. The board contains 1 PCI bridge, 2 FPGAs, 4 memory ICs, 6 voltage regulators, and 35 resistors.

GE IS200EPMCH1A IS200EPMCH1ADB distributes energy storage across multiple ceramic capacitors. Each FPGA power rail uses 22 µF at 6.3V for local decoupling. This arrangement maintains stable core voltages during 5 microsecond current transients. Therefore, the board prevents logic errors under heavy processing loads.

Design and Integration

Both the GE IS200EPMCH1A and GE IS200EPMCH1ADB versions share identical PCI interface logic. These boards use eight-layer PCB construction with controlled impedance traces for high-speed signals. Consequently, the GE IS200EPMCH1A IS200EPMCH1ADB operates reliably from 0°C to +55°C ambient temperature.

For installation, you plug the board into a standard PMC carrier slot. The board draws 500 mA typical current from the 3.3V supply. During FPGA configuration, it briefly consumes 800 mA for about 200 milliseconds. We recommend using forced air cooling for multiple stacked cards.

Practical Application

This mezzanine card adds custom I/O or processing capability to a host carrier board. It implements digital signal processing algorithms inside the onboard FPGAs. The GE IS200EPMCH1A IS200EPMCH1ADB communicates via the PCI bus at 66 MHz speed. Therefore, it serves as a flexible expansion module for GE turbine control systems.

Details