I/O modules

This backplane serves as the central interconnect for GE Mark VI control modules. You will find the GE IS200CABPG1A IS200CABPG1ACA Control Assembly Backplane distributing both power and data across all installed cards. Its rugged construction supports reliable operation in demanding turbine environments.

Technical Specifications

This backplane features eight card edge connectors arranged in a single row. You can also locate six mounting points for secure rack attachment. The GE IS200CABPG1A IS200CABPG1ACA Control Assembly Backplane stores no battery energy or charge of any kind. Instead, it uses only passive copper traces for all signal routing. Therefore, this backplane never needs any form of routine maintenance.

Signal and Power Distribution

The GE IS200CABPG1A IS200CABPG1ACA Control Assembly Backplane routes signals between eight independent module slots. Each card connector contains 96 gold-plated pins for reliable electrical contact. You can install any combination of Mark VI I/O or processor cards on this backplane. Moreover, the board integrates separate ground planes for analog and digital circuits. This design minimizes noise coupling between sensitive measurement channels.

Mechanical Integration and Mounting

You must mount the GE IS200CABPG1A IS200CABPG1ACA Control Assembly Backplane inside a standard 19-inch industrial rack. After positioning, secure the board using six M4 screws through the designated holes. The backplane measures exactly 33.0 centimeters in length and 23.0 centimeters in width. Its total weight reaches approximately 1.6 kilograms for stable mechanical support. Furthermore, the board includes plastic card guides at each connector position for easy module insertion.

Environmental and Storage Guidelines

You should store this GE IS200CABPG1A IS200CABPG1ACA Control Assembly Backplane on a flat anti-static surface away from moisture. The backplane operates reliably between -30°C and +65°C ambient temperature. Likewise, keep the unit away from conductive dust or metal debris. Because the backplane contains no active semiconductors, it offers exceptional long-term durability with zero power consumption.

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