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I/O modules

GE IC695CHS016 PACSystems RX3i Universal Backplane

Brand:  GE Fanuc
Model Number:IC695CHS016
Type: PACSystems RX3i Universal Backplane
Product Origin: USA
Price: USD 99
Dimensions:  43.2 cm x 20.3 cm x 12.7 cm
Weight: 3.8 kg
Warranty: 12 months

1000 in stock

SKU IC695CHS016 Category Tags , Brand:

Product Overview

This universal backplane provides the foundation for building PACSystems RX3i control systems. It accommodates both standard and high-speed I/O modules in a single chassis. The IC695CHS016 features sixteen slots for mounting various controller and I/O modules. Its passive design ensures reliable signal routing between installed components without active circuitry. This backplane supports both Series 90-30 legacy modules and newer RX3i intelligent devices.

Technical Specifications

The IC695CHS016 measures 43.2 cm in width, 20.3 cm in height, and 12.7 cm in depth. It weighs approximately 3.8 kg, including all connectors and mounting hardware. This backplane operates without requiring any external power supply connections. It provides sixteen 48-pin module slots arranged in a single horizontal row. The backplane incorporates a 32-bit VME-style data bus for high-speed communication. It supports data transfer rates up to 80 MB/s between modules and the CPU. Each slot delivers dedicated power distribution from the chassis power supply. The board features four layers of copper traces for optimal signal integrity. It maintains matched impedance across all data and address lines for reliable operation.

Slot Configuration and Bus Architecture

This backplane distributes power and communication signals across all sixteen slots simultaneously. It supports both 5 VDC and 24 VDC power rails for diverse module requirements. The IC695CHS016 includes a dedicated expansion connector for linking multiple chassis together. Each slot position provides clear labeling for easy module identification and installation. The backplane also features a 5-slot power distribution scheme for balanced load management.

Physical and Electrical Parameters

ParameterSpecification
Dimensions (W x H x D)43.2 cm x 20.3 cm x 12.7 cm
Weight3.8 kg
Slot Count16 universal module slots
Connector Type48-pin per slot
Data Bus32-bit VME-style architecture
Transfer RateUp to 80 MB/s
PCB Layers4-layer with impedance control
Power Rails+5 VDC and +24 VDC
Expansion PortInter-chassis link connector
MountingStandard DIN rail or panel
Operating Temperature0°C to 60°C
Storage Temperature-40°C to 85°C
Humidity5% to 95% non-condensing

Installation and System Integration

Mount the IC695CHS016 securely inside the control cabinet using the provided mounting holes. Install modules sequentially into the slots according to your system configuration. Connect the expansion cable to link multiple chassis for larger applications. Apply power from the system power supply to the designated input terminals. The backplane automatically establishes communication between all inserted modules. Verify each module seats fully into its connector for reliable electrical contact.

Typical Applications

This backplane serves as the backbone for RX3i control systems in many industries. It supports process control, discrete manufacturing, and hybrid automation applications. The IC695CHS016 accommodates mixed module types in a single chassis. Its universal design simplifies system upgrades and expansions over time.

Details

Weight3.8 kg
Dimensions432 × 203 × 127 mm

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