The GE IC200CHS002F serves as a box-style I/O carrier within the VersaMax family, designed to house and interconnect various I/O modules. This carrier provides mechanical support and electrical connectivity for up to five modules in a compact enclosure. It effectively expands system capacity while maintaining organized field wiring arrangements.
Physical Characteristics and Build Quality
Engineers constructed this carrier using rugged thermoplastic with reinforced mounting points for industrial durability. The unit measures approximately 18 centimeters in height, 25 centimeters in width, and 6 centimeters in depth. Its total weight reaches roughly 0.7 kilograms, allowing easy handling during installation. The integrated DIN rail mounting clip simplifies panel mounting without requiring additional hardware.
Technical Specifications
| Parameter | Specification |
|---|---|
| Dimensions | 18 cm (H) x 25 cm (W) x 6 cm (D) |
| Weight | 0.7 kg approximately |
| Enclosure Material | Rugged thermoplastic, UL 94V-0 rated |
| Module Capacity | 5 I/O modules maximum |
| Mounting Options | DIN rail or panel mount with screws |
| Backplane Current | 3.3 VDC at 2.5 A, 5 VDC at 1.2 A |
| Power Supply Connection | Removable terminal block, 12-24 VDC |
| Field Wiring | Access via integral wiring channels |
| Operating Temperature | 0°C to +60°C |
| Humidity Range | 5% to 95% non-condensing |
| Vibration Resistance | 1 g at 10-150 Hz |
| Shock Resistance | 10 g operational, 30 g non-operational |
| Agency Approvals | UL, cUL, CE marked |
Module Mounting and Integration
The carrier accepts any combination of GE VersaMax discrete, analog, or special function modules. You simply snap each module into the designated slot until it locks securely. The backplane automatically provides power and communication to all installed modules. Consequently, this design eliminates the need for individual module wiring to the power supply.
Power Distribution Capabilities
The IC200CHS002F distributes power from the field-side connection to all installed modules through the internal backplane. It accepts 12 to 24 VDC input and generates the necessary logic voltages for module operation. Built-in filtering capacitors smooth voltage fluctuations and protect sensitive electronics. The carrier also provides separate field power distribution for output devices.
Field Wiring Organization
Integral wiring channels guide field wiring neatly to each module’s termination points. Removable covers protect wiring while allowing easy access for troubleshooting. You can route wires through multiple entry points on all sides of the enclosure. This flexibility significantly simplifies cabinet layout and wire management tasks.
System Expansion Benefits
Adding this carrier to an existing VersaMax system expands I/O capacity without requiring additional controllers. You can connect multiple carriers via expansion cables for distributed I/O architectures. The IC200CHS002F maintains seamless communication with the main CPU through the VersaMax backplane protocol. This scalability makes it ideal for growing automation applications.
Environmental Resistance
The rugged enclosure protects internal modules from dust, moisture, and industrial contaminants. Its UL 94V-0 flame-retardant rating ensures safety in critical applications. The carrier withstands vibration up to 1 g and operational shock to 10 g without connection loss. Therefore, it suits installations in manufacturing, material handling, and process control environments.
Installation Guidelines
Mount the carrier on standard 35 mm DIN rail or directly to a panel using the integrated holes. You should allow adequate clearance around the unit for wiring and module access. Connect field power to the removable terminal block before inserting any I/O modules. Always verify power polarity and voltage before energizing the system.
Details
| Weight | 0.1 kg |
|---|---|
| Dimensions | 25 × 108 × 127 mm |

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